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    A Foil Flip-Chip Interconnect With an Ultra-Broadband Bandwidth of 130 GHz and Beyond for Heterogeneous High-End System Designs

    A Foil Flip-Chip Interconnect With an Ultra-Broadband Bandwidth of 130 GHz and Beyond for Heterogeneous High-End System Designs by Tim Pfahler, Andre Scheder, Anna Bridier, Mathias Nagel, Martin Vossiek

    Published 2024-01-01
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