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    Creep of Sn-0.3Ag-0.7Cu solder in electronic packaging: Experiment and simulation

    Creep of Sn-0.3Ag-0.7Cu solder in electronic packaging: Experiment and simulation by Yuezong Zheng, Junchen Liu, Hongchao Ji, Xiaomin Huang, Wenchao Xiao, Abdullah Aziz Saad

    Published 2025-01-01
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